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Relife RL-428-OR BGA soldering flux Welding paste For Mobile PCB/BGA/PGA Repair (100g)
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Product details
Relife RL-428-OR BGA soldering flux Welding paste For Mobile PCB/BGA/PGA Repair (100g)
high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. Good formula for BGA reballing / balls worksit can stick the balls much more.
| Weight | 0.120 kg |
|---|---|
| Dimensions | 8 × 6 × 6 cm |
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