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B&R IC-08A Mobile Phone Motherboard Chip Solder Joint Repair Dot Pad
₹500.00 Original price was: ₹500.00.₹299.00Current price is: ₹299.00.
Product details
B&R IC-08A Flywire Repair Spot Welding Patch With Ultra-thin And Fixed Pins For Different Sizes Of Solder Pads On Mobile Phones
Features:
- Re-repair spot welds, enhance fixed pins, ultra-thin patching experience, tear-off protection, and ready-to-use
- Multi-specification and different shapes of solder joints, suitable for the pads of various mobile phone drop points
- 2nd generation upgrade, adding fixed pins to the original pads to prevent the pads from falling off
- Just tear off the protective layer, and immediately repair without traces to achieve the original pad effect
- Can be used for mobile phone motherboard IC pads or double-layer full-board middle layer, CPU/WiFi hard disk/big audio/touch IC/ and other pads due to drop shock or extrusion cause the pad to drop
- Reject the cumbersome flying wire looping method. After spot welding of the double-layer motherboard, it can be directly placed on the middle-layer functional test frame or directly attached to improve maintenance efficiency
- Ultra-thin patch, using industrial grade printed circuit board copper foil, the thickness is only 30μm
- The flatness of the solder tab is good, which can effectively prevent the virtual welding caused by unevenness, and strengthen the bonding point between the fixed pin and the circuit
Specification:
- Brand: B&R
- Name: Rework Spot Solder Tabs
- Product model: IC-08A
- Product size: 98*68mm
- Packing size: 80*120mm
- Features: No trace repair, quick repair point, tear-off protection, and ready-to-use, improve maintenance efficiency
- Application: Suitable for mobile multiple sizes solder pad
- Package includes:
- 1 x Solder Joint Repair Pad
Weight | 0.020 kg |
---|---|
Dimensions | 12 × 8 × 1 cm |
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