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nt PPD Solder Paste
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Product details
nt PPD 183℃ low temperature solder paste for Mobile Phone CPU IC chip repair, PPD best melting point 183 degrees
The solder paste with a melting point of 183 degrees is called low temperature solder paste, and its alloy composition is SnBi. When the components of the patch can not withstand temperatures above 183 C, the solder paste is welded with low temperature solder paste. To protect against high temperature.
Product Features :
- Excellent capacity of solder-stickiness
- Excellent Anti-wet capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- No-clean and Lead free for environmental protection
Specifications
- Product name: B&R high-quality BGA solder paste ( PPD Paste )
- Product model: nt-30 nt-40
- Product specifications: 30g / bottle 40g
- Melting point: 183.
- Product list: Solder paste
- Storage environment: refrigerated (0~10)
- Alloy : Sn63/Pb37
- Microns : 24-45UMPacking List :
- 1pc x Solder Paste
| Weight | N/A |
|---|---|
| Dimensions | N/A |
| Model | BR-30, BR-40 |
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nt PPD Solder Paste
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