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Sunshine G-20 Super Strong Adhesive Glue For Mobile Repair ( Transparent )
₹150.00Original price was: ₹150.00.₹75.00Current price is: ₹75.00. -
MT 6377W Power IC For Redmi 13C 5g, 13 5g
₹470.00Original price was: ₹470.00.₹320.00Current price is: ₹320.00. -
MECHANIC 850 Pro Cleaning Water ( 1000g ) For PCB Board Ultrasonic Cleaner
₹800.00Original price was: ₹800.00.₹449.00Current price is: ₹449.00. -
Digital Microscope 7 Inch LCD 12MP 1-1200X Continuous Amplification Magnifier with Metal Stand and Two Auxiliary Lights ( B1200 )
₹9,999.00Original price was: ₹9,999.00.₹4,399.00Current price is: ₹4,399.00. -
MT6357 MRV Orignal Power IC For Vivo Y81, Redmi 5+, Huawei Y6
₹380.00Original price was: ₹380.00.₹220.00Current price is: ₹220.00.
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Relife RL-039 BGA IC High Effect Adhesive Remove Liquid (20ML)
₹500.00 Original price was: ₹500.00.₹449.00Current price is: ₹449.00.
Product details
Relife RL-039 BGA IC High Effect Adhesive ( Black Glue ) Remove Liquid
RELIFE RL-039 Remove Glue Liquid Soften Remove Resin Glue PCB BGA IC Chip Solid Glue Degenerate Motherboard Repair Tools
Usage: shake well before use.  Take a proper amount of the adhesive removal solution carefully with a pipette,drip it into the sealant required for removal, place the mainboard and BGA IC horizontally for 5–10 minutes to soften the sealant and use a special tool to carefully peel off the soften sealant. Pay attention to the wiring around the BGA IC chip and mobile phone mainboard copper foil circuit when peeling off. Wash off the residual adhesive and solution on  the chip mainboard after adhesive removal.
Weight | 0.200 kg |
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Dimensions | 8 × 2 × 2 cm |
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