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Sunshine G-20 Super Strong Adhesive Glue For Mobile Repair ( Transparent )
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MECHANIC 850 Pro Cleaning Water ( 1000g ) For PCB Board Ultrasonic Cleaner
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MT6357 MRV Orignal Power IC For Vivo Y81, Redmi 5+, Huawei Y6
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Kingbo RMA-218 BGA soldering flux paste For Mobile PCB/BGA/PGA Repair (100g)
Original price was: ₹400.00.₹399.00Current price is: ₹399.00.
Product details
Kingbo RMA-218 BGA soldering flux paste For Mobile PCB/BGA/PGA Repair (100g)
Detalles The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. It is original made in Japan. Good formula for BGA reballing / balls worksit can stick the balls much more.
| Weight | 0.120 kg |
|---|---|
| Dimensions | 8 × 6 × 6 cm |
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Sunshine G-20 Super Strong Adhesive Glue For Mobile Repair ( Transparent )
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