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Relife RL-039 BGA IC High Effect Adhesive Remove Liquid (20ML)
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Product details
Relife RL-039 BGA IC High Effect Adhesive ( Black Glue ) Remove Liquid
RELIFE RL-039 Remove Glue Liquid Soften Remove Resin Glue PCB BGA IC Chip Solid Glue Degenerate Motherboard Repair Tools
Usage: shake well before use.  Take a proper amount of the adhesive removal solution carefully with a pipette,drip it into the sealant required for removal, place the mainboard and BGA IC horizontally for 5–10 minutes to soften the sealant and use a special tool to carefully peel off the soften sealant. Pay attention to the wiring around the BGA IC chip and mobile phone mainboard copper foil circuit when peeling off. Wash off the residual adhesive and solution on  the chip mainboard after adhesive removal.
| Weight | 0.200 kg |
|---|---|
| Dimensions | 8 × 2 × 2 cm |
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